The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Dec. 18, 1998
Applicant:
Inventors:
Yasushi Taniguchi, Kawasaki, JP;
Hiroshi Kono, Yokohama, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
For providing a semiconductor package with improved moisture resistance and high reliability and a production method thereof, a solder resist is also provided in an appropriate thickness between electrodes of conductor circuits on a surface of a substrate. The resist in these portions is obtained by patterning the solder resist while leaving the solder resist between the conductor circuits by removing the unnecessary solder resist under irradiation of a laser.