Canon Kabushiki Kaisha

Hiroshi Kono

Yasushi Taniguchi

Masami Ikeda

Toshio Kashino

Takashi Watanabe

Akio Saito

Kazuaki Masuda

Akira Goto

Nobuyuki Kuwabara

Koyo Midorikawa

Toru Okumura

Takashi Kanzaki

Masaaki Matsushima

For providing a semiconductor package with improved moisture resistance and high reliability and a production method thereof, a solder resist is also provided in an appropriate thickness between electrodes of conductor circuits on a surface of a substrate. The resist in these portions is obtained by patterning the solder resist while leaving the solder resist between the conductor circuits by removing the unnecessary solder resist under irradiation of a laser.

Semiconductor package and production method thereof

A printed circuit board is free from any residue of the carbide of resin produced on the surface of its copper foil exposed after boring a blind hole by means of a laser beam. Such a printed circuit board is adapted to have a blind hole bored through an insulator until the hole gets to the copper foil arranged under the insulator by irradiating the insulator with a laser beam. A laser beam absorbing region is provided between said insulator and said copper foil

Circuit board and method of manufacturing a circuit board

An ink jet recording head, which can be used in a recording apparatus, is manufactured by preparing a first base plate provided with an energy generating structure for generating energy to discharge ink, preparing a second base plate provided with a discharge opening plate member on which are to be formed ink discharge openings for discharging the ink and recessed portions for forming ink flow paths, the ink flow paths being communicated with the discharge openings, and applying an ink repellant treatment on a surface of the discharge opening plate at a side where the ink is to be discharged in at least an area where the discharge openings are to be formed. The discharge opening is formed on the discharge opening plate by irradiating a laser beam on a rear surface of the discharge opening plate at the opposite side from where the ink is discharged, and the first base plate and second base plate are connected so that the energy generating structure and recessed portion face one another to form the ink flow paths.

Method for manufacturing an ink jet head having a treated surface, ink

The present invention relates to a method for manufacturing an ink jet recording head having an ink path communicated with a discharge opening, a discharge energy generating element disposed in the ink path and a discharge opening plate on which the discharge opening is formed. The discharge opening plate is attached to an end surface of the ink path. The discharge opening is formed by irradiating an excimer laser light on the discharge opening plate from a side of the plate which is attached to the ink path.

Ink jet head and manufacturing method thereof, and ink jet apparatus

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Yokohama, Japan

Hiroshi Kono