Location History:
- Yokohama, JP (2002)
- Kanagawa-ken, JP (2004 - 2006)
Company Filing History:
Years Active: 2002-2006
Title: Hiroshi Funakura: Innovator in Semiconductor Technology
Introduction
Hiroshi Funakura is a prominent inventor based in Kanagawa-ken, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative semiconductor packages that enhance performance and reliability.
Latest Patents
Hiroshi Funakura's latest patents include a groundbreaking semiconductor package that features an interposer, a wiring layer with conductors arranged to prevent short circuits, and a light-blocking layer. This design effectively blocks light from passing through specific areas, ensuring optimal functionality. Another notable patent is for a semiconductor package and method of manufacturing the same, which includes a package base, package terminals, and a low-elasticity resin layer. This invention aims to improve the connection between semiconductor packages and other devices.
Career Highlights
Hiroshi Funakura is currently employed at Kabushiki Kaisha Toshiba, a leading company in the technology sector. His work at Toshiba has allowed him to develop and refine his innovative ideas in semiconductor packaging, contributing to the company's reputation for excellence in technology.
Collaborations
Hiroshi has collaborated with notable coworkers such as Eiichi Hosomi and Mitsuru Oida. Their combined expertise has fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Hiroshi Funakura's contributions to semiconductor technology through his patents and work at Toshiba highlight his role as a key innovator in the field. His inventions continue to influence the industry and pave the way for future advancements.