Sakado, Japan

Hiroo Ogawa

This inventor holds 8 USPTO granted patents and 5 EPO patents. Top assignee: Tamura Corporation. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroo Ogawa. Retrieved from https://idiyas.com/inventor/hiroo-ogawa-1ldv7ixc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Sakado, JP (2019)
  • Saitama, JP (2020 - 2024)

Company Filing History:


Years Active: 2019-2025

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8 patents (USPTO):Explore Patents

Title: Hiroo Ogawa: Innovator in Semiconductor Technology

Introduction

Hiroo Ogawa is a prominent inventor based in Sakado, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of eight patents. His work has been instrumental in advancing the capabilities of semiconductor devices.

Latest Patents

Among his latest innovations is the semiconductor driving circuit module. This invention showcases his expertise in creating efficient and effective solutions for semiconductor applications. The advancements in this area have the potential to enhance various electronic devices.

Career Highlights

Hiroo Ogawa is currently employed at Tamura Corporation, where he continues to develop innovative technologies. His role at the company allows him to collaborate with other talented engineers and contribute to cutting-edge projects in the semiconductor industry.

Collaborations

Some of his notable coworkers include Tomohiko Yoshino and Hirotoshi Aoki. Their combined efforts in research and development have led to significant advancements in semiconductor technology.

Conclusion

Hiroo Ogawa's contributions to the field of semiconductor technology are noteworthy. His patents and collaborations reflect his commitment to innovation and excellence in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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