The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

May. 16, 2019
Applicant:

Tamura Corporation, Nerima-ku, Tokyo, JP;

Inventors:

Hiroo Ogawa, Saitama, JP;

Tomohiko Yoshino, Saitama, JP;

Assignee:

TAMURA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H01F 27/30 (2006.01); H01F 27/28 (2006.01); H05K 1/16 (2006.01); H01F 27/26 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/306 (2013.01); H01F 27/2804 (2013.01); H05K 1/165 (2013.01); H01F 27/263 (2013.01); H01F 27/29 (2013.01); H01F 2027/2809 (2013.01); H01F 2027/2819 (2013.01);
Abstract

An electronic componentincludes: a circuit board modulewhich is composed of a plurality of layers, and in which a primary circuitand secondary circuitsare each formed using wring patterns of a first layer Lto an eighth layer L; and a magnetic corewhich magnetically couples the primary circuitand the secondary circuits. The circuit board moduleincludes: cutout portionswhich are formed in a cutout shape from side edge portions toward an inner side and which position the magnetic coreat a predetermined attachment position in a state of housing the magnetic core; and widened portionswhich continue from the cutout portionsand are formed in a cutout shape from the side edge portions toward the inner side of the circuit board module, and which are formed on sides of the magnetic coreso as to be larger than a width Wfor housing of the cutout portions


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