Tokyo, Japan

Hironori Kashimoto

This inventor holds 2 USPTO granted patents. Top assignee: Mitsubishi Electric Corporation. Active years: 2009-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hironori Kashimoto. Retrieved from https://idiyas.com/inventor/hironori-kashimoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2009-2010

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2 patents (USPTO):Explore Patents

Title: Hironori Kashimoto: Innovator in Semiconductor Technology

Introduction

Hironori Kashimoto is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to device design.

Latest Patents

One of his latest patents is a semiconductor device with thermoplastic resin to reduce warpage. This invention includes a radiating plate, a wiring patterned layer on the radiating plate via an insulating layer, and at least one semiconductor chip mounted on the wiring patterned layer. The semiconductor chip features a surface electrode, and the device further includes a conductive lead plate electrically connected to the surface electrode. The resin package made of thermoplastic resin has an anisotropic linear expansion coefficient that varies based on directions, effectively reducing warpage in both longitudinal and transverse directions.

Another notable patent is a semiconductor device that comprises a base plate, an insulating substrate on the base plate, and a wiring patterned layer on the insulating substrate. This device also includes at least one semiconductor chip bonded to the wiring patterned layer, with a surface electrode. A main terminal is connected via a conductive adhesive layer to either the surface electrode or the wiring patterned layer. The resin package covers the insulating substrate, wiring patterned layer, semiconductor chip, conductive adhesive layer, and a portion of the main terminal.

Career Highlights

Hironori Kashimoto is associated with Mitsubishi Electric Corporation, where he has been instrumental in advancing semiconductor technologies. His work has contributed to the development of more efficient and reliable semiconductor devices.

Collaborations

He has collaborated with notable coworkers such as Tatsuo Ota and Shingo Sudo, further enhancing the innovative capabilities within his team.

Conclusion

Hironori Kashimoto's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence in the field. His work continues to influence the development of advanced electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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