Buzen, Japan

Hironari Kotsubo


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Hironari Kotsubo: Innovator in Optical Semiconductor Manufacturing

Introduction

Hironari Kotsubo is a notable inventor based in Buzen, Japan. He has made significant contributions to the field of optical semiconductor devices. His innovative approach has led to the development of a unique method for manufacturing these devices.

Latest Patents

Kotsubo holds 1 patent for his invention titled "Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig." This patent outlines a method that includes preparing an optical semiconductor connected to a lead frame, forming a thermoplastic resin for a package molding jig, and filling packaging resin into the jig.

Career Highlights

Kotsubo is associated with Kabushiki Kaisha Toshiba, a prominent company in the technology sector. His work focuses on enhancing the manufacturing processes of optical semiconductor devices, which are crucial for various electronic applications.

Collaborations

Kotsubo has collaborated with notable colleagues such as Masaki Adachi and Masaharu Yamanaka. Their combined expertise contributes to the advancement of technology in the semiconductor industry.

Conclusion

Hironari Kotsubo's innovative methods in optical semiconductor manufacturing highlight his role as a key inventor in the field. His contributions continue to influence the development of advanced electronic devices.

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