The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Mar. 07, 2005
Masaki Adachi, Yokohama, JP;
Masaharu Yamanaka, Yokohama, JP;
Fumihide Nagashima, Yokohama, JP;
Tatsuhiko Nagafuchi, Kitakyushu, JP;
Takao Abe, Yukuhashi, JP;
Masayoshi Harada, Buzen, JP;
Hirofumi Hansei, Buzen, JP;
Hironari Kotsubo, Buzen, JP;
Masaki Adachi, Yokohama, JP;
Masaharu Yamanaka, Yokohama, JP;
Fumihide Nagashima, Yokohama, JP;
Tatsuhiko Nagafuchi, Kitakyushu, JP;
Takao Abe, Yukuhashi, JP;
Masayoshi Harada, Buzen, JP;
Hirofumi Hansei, Buzen, JP;
Hironari Kotsubo, Buzen, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.