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For the Inventor, By the Inventor

Obu, Japan

Hiromasa Hayashi

This inventor holds 11 USPTO granted patents. Top assignee: Denso Corporation. Active years: 2005-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiromasa Hayashi. Retrieved from https://idiyas.com/inventor/hiromasa-hayashi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 45.5

Average Co-Inventor Count = 2.2

ph-index = 3

Forward Citations = 31(Granted Patents)


Location History:

  • Oobu, JP (2007)
  • Obu, JP (2005 - 2018)
  • Kariya, JP (2021)

Company Filing History:

goldMedal11 out of 20,407 
 
Denso Corporation
 patents

Years Active: 2005-2021

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11 patents (USPTO):Explore Patents
1. 10998295 - Semiconductor device (2021-05-04),
2. 9922906 - Electronic device and manufacturing method of electronic device (2018-03-20),
3. 9123711 - Wiring member and semiconductor module having the same (2015-09-01),
4. 9006883 - Semiconductor module with switching elements (2015-04-14),
5. 8649159 - Semiconductor module device and driving apparatus having the same (2014-02-11),
6. 8471417 - Semiconductor module device and driving apparatus having the same (2013-06-25),
7. 8415027 - Laser welding structure (2013-04-09),
8. 7308344 - Tire rotation assisting apparatus (2007-12-11),
9. 7168306 - Tire air pressure detection system (2007-01-30),
10. 6954141 - Apparatus and method for tire monitoring system (2005-10-11),
11. 6897769 - Tire pressure monitoring system and method for registering identification code in the same (2005-05-24),

Title: Hiromasa Hayashi: Innovator in Semiconductor Technology

Introduction

Hiromasa Hayashi is a prominent inventor based in Obu, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His innovative work has paved the way for advancements in electronic devices.

Latest Patents

One of Hayashi's latest patents is a semiconductor device that includes a first chip to restrict current flow in a first direction through a current path. A second chip restricts the current flow in the opposite direction, and the device features a wiring that connects both chips. This wiring acts as a shunt resistor with a resistive body, and the lead frame includes a sense terminal to detect voltage drop across the resistive body. Another notable patent is for an electronic device that comprises first to third terminals and a clip. The clip has joint portions that bond to the terminals, with one terminal featuring a depressed portion to store conductive bonding material. This design allows for the absorption of positional variations through the deformation of the bonding material.

Career Highlights

Hiromasa Hayashi is currently employed at Denso Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Hayashi has collaborated with notable coworkers, including Toshihiro Fujita and Hiroyasu Kidokoro. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Hiromasa Hayashi's contributions to semiconductor technology and electronic devices highlight his role as a leading inventor in the field. His innovative patents and collaborations continue to influence advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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