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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10998295 B1

PDFFull Text
Date of Patent:
May. 04, 2021

Filed:

Mar. 21, 2019

Semiconductor device

Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Hiromasa Hayashi, Kariya, JP;

Shunsuke Tomoto, Kariya, JP;

Yusuke Mori, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01); G01R 19/00 (2006.01); G01R 15/14 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); G01R 15/146 (2013.01); G01R 19/0092 (2013.01); H01L 23/3121 (2013.01); H01L 23/4006 (2013.01); H01L 23/48 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/45111 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45149 (2013.01); H01L 2224/45155 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/18301 (2013.01);
Abstract

A semiconductor device includes: a first chip to restrict current flow in a first direction through a current path; a second chip to restrict the current flow in a second direction opposite to the first direction, through the current path; a wiring having one end connected to the first chip and the other end connected to the second chip, and provided as a part of the current path by relaying the first chip and the second chip; a lead frame having a first lead arranged and fixed with the first chip and a second lead is arranged and fixed with the second chip; and molding resin sealing the first chip, the second chip, the wiring and the lead frame. The wiring is a shunt resistor having a resistive body. The lead frame further has a sense terminal to detect a voltage drop across the resistive body.

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