Denso Corporation

Hiromasa Hayashi

Toshihiro Fujita

Hiroyasu Kidokoro

Takatoshi Sekizawa

Masayuki Takenaka

Ryozo Okumura

Akihiro Taguchi

Toshihiro Nagaya

Shunsuke Tomoto

Hiroshi Kasugai

Masaji Imada

Yusuke Mori

Nobuhiko Okada

A semiconductor device includes: a first chip to restrict current flow in a first direction through a current path; a second chip to restrict the current flow in a second direction opposite to the first direction, through the current path; a wiring having one end connected to the first chip and the other end connected to the second chip, and provided as a part of the current path by relaying the first chip and the second chip; a lead frame having a first lead arranged and fixed with the first chip and a second lead is arranged and fixed with the second chip; and molding resin sealing the first chip, the second chip, the wiring and the lead frame. The wiring is a shunt resistor having a resistive body. The lead frame further has a sense terminal to detect a voltage drop across the resistive body.

Semiconductor device

An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.

Electronic device and manufacturing method of electronic device

A wiring member includes a first leg portion, a second leg portion, a third leg portion, a first connecting wall and a second connecting wall. The first leg portion is electrically connected to a first conductive portion. The second leg portion is electrically connected to a second conductive portion. The third leg portion is electrically connected to a third conductive portion. The first connecting wall connects the first leg portion and the second leg portion. The second connecting wall connects the second leg portion and the third leg portion. The first leg portion, the second leg portion, and the third leg portion are non-linearly arranged.

Wiring member and semiconductor module having the same

In a semiconductor module, an upper arm switching element is integrated to a high-potential conductor coupled to a high-potential electrode of a power source, and a lower arm switching element is integrated to a load conductor coupled to a load. A first connecting conductor has a first end connected to the upper arm switching element and a second end connected to the load conductor. A second connecting conductor has a first end connected to the lower arm switching element and a second end connected to a low-potential conductor coupled to a low-potential electrode of the power source. At least one of the first connecting conductor and the second connecting conductor serves as a shunt resistor for detecting an electric current flowing in the at least one.

Semiconductor module with switching elements

A controller has a control board, a power module and a power board. MOS transistors, inverter input terminals, coil terminals, inverter ground terminals, control terminals, a control power input terminal and a control ground terminal are integrally molded in a molded portion of a power module. Electrical connections between the power module and the control and power boards are made through the terminals provided in the molded portion.

Semiconductor module device and driving apparatus having the same

An inverter input terminal, a coil terminal for a U-phase coil, and an inverter ground terminal are arranged in this order and neighboring to one another to form a U-phase terminal group. An inverter input terminal, a coil terminal for a V-phase coil, and the inverter ground terminal are arranged in this order and neighboring to one another to forma V-phase terminal group. The inverter input terminal, a coil terminal for a W-phase coil, and an inverter ground terminal are arranged in this order and neighboring to one another to form a W-phase terminal group. Flow directions of electric current in the neighboring terminals are opposite to each other, so that inductance of inverter circuits can be decreased.

A laser welding structure includes a lead, a conductive member, and a welding part. The lead has a nickel plating layer and is made of copper or copper alloy. The conductive member is joined with the lead and is made of copper or copper alloy. The welding part is formed by a laser welding so as to join the lead and the conductive member. An end portion of the welding part has a rounded convex shape.

Laser welding structure

Tire-side transmitters, attached to respective tires, have inherent ID numbers. On-vehicle receivers, disposed on an automotive vehicle, receive signals containing ID numbers. A control unit, disposed on the automotive vehicle, can identify tire mounting positions of respective tires based on the signals containing ID numbers received by the on-vehicle receivers. The controlling means memorizes information related to tire mounting positions of respective tires. Furthermore, the controlling means causes a displaying means disposed on the automotive vehicle to inform an automobile user of information relating to tire rotation, such as appropriate shifting directions instructing desirable tire mounting positions for respective tires, when predetermined tire rotation timing has come.

Tire rotation assisting apparatus

A tire air pressure detection system having a transmitter provided at each of a plurality of wheels provided with tires and sending out a detection signal corresponding to the air pressure of the tire attached to the corresponding wheel and a receiver provided at the chassis side and provided with first antennas arranged near the transmitters of the plurality of wheels and a first controller receiving detection signals through the first antennas and finding the air pressures of the tires provided at the plurality of wheels based on the detection signals, wherein the receiver is designed so that the first controller measures the strength of each the detection signal, sets a power control signal in accordance with that strength, then sends the power control signal to the transmitter originating the detection signal, and each transmitter is provided with a second antenna receiving its corresponding power control signal and a second controller controlling a transmission power for sending the detection signal based on the received power control signal.

Tire air pressure detection system

A tire monitoring apparatus for a vehicle has plural transmitters arranged in plural tires for detecting air pressure of the corresponding tire and transmitting information including a detecting result by a radio wave, plural receivers for receiving the information transmitted from the respective transmitters, and signal receiving sensitivity changing means for changing signal receiving sensitivities. In the apparatus, each of the receivers is arranged in such a manner that a distance between one receiver and its corresponding transmitter is made shorter than the other distances between the one receiver and the other transmitters. A control means controls the signal receiving sensitivity changing means such that each of the receivers receives only the information included in the radio wave, which has a largest signal receiving level among the radio waves transmitted from the plural transmitters.

Apparatus and method for tire monitoring system

A tire pressure monitoring ECU receives inputs indicative of identification (ID) codes, each of which is uniquely assigned to each sensor unit provided to each tire of a vehicle, via a bar code reader. It stores the ID codes and compares it with ID codes contained in signals from the sensor units, respectively. When the result of the comparison satisfies a predetermined condition, the stored ID code is registered as an ID code corresponding to the uniquely assigned ID code of the sensor unit.

Growing community of inventors

Obu, Japan

Hiromasa Hayashi