This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 1994.
Company Filing History:
1 out of 834,350 Years Active: 1994
Title: Hiroko Ota - Innovator in Wafer Technology
Introduction
Hiroko Ota is a prominent inventor based in Nagano, Japan. She has made significant contributions to the field of semiconductor technology, particularly in the development of bonded wafers. Her innovative approach has led to advancements that enhance the manufacturing processes in this critical industry.
Latest Patents
Hiroko Ota holds a patent for a bonded wafer and the method of manufacturing it. This invention involves a bonded wafer comprising a filmy bond wafer, a base wafer, and an intermediate silicon dioxide layer. The process includes several steps: subjecting the bond wafer to an oxidation treatment to form an oxide film, joining the two wafers with the oxide film-covered face of the bond wafer on the base wafer, heating the combined wafers to create bonding strength, grinding the exposed face of the bond, etching the periphery of the bond wafer, and polishing the exposed face until it becomes a thin film. This patent showcases her expertise and innovative thinking in wafer technology.
Career Highlights
Throughout her career, Hiroko Ota has demonstrated a commitment to advancing semiconductor technology. Her work has not only contributed to her own professional growth but has also influenced the industry as a whole. With a patent count of 1 patent, she continues to be a valuable asset in her field.
Collaborations
Hiroko has collaborated with notable colleagues such as Susumu Nakamura and Tokio Takei. These partnerships have allowed her to share knowledge and drive innovation in wafer technology.
Conclusion
Hiroko Ota is a trailblazer in the field of bonded wafer technology. Her innovative patent and collaborative efforts highlight her significant role in advancing semiconductor manufacturing processes. Her contributions continue to impact the industry positively.