Hiroki Yokoyama

Title: Hiroki Yokoyama: Innovator in Device Bonding Technology

Introduction

Hiroki Yokoyama is a notable inventor based in Shunan, Japan. He has made significant contributions to the field of device bonding technology, holding a total of 2 patents. His work focuses on enhancing the bonding strength of devices to substrates, which is crucial for various electronic applications.

Latest Patents

Yokoyama's latest patents include innovative methods for manufacturing substrates for device bonding. One of his patents describes a substrate that enables high bond strength to an Au electrode formed on substrates like aluminum nitride. This is achieved by soldering the device at low temperatures using a soft solder metal, specifically an Au–Sn-based solder with a 10% by weight Au content. The substrate comprises multiple layers, including a platinum group element layer, a transition metal layer, a barrier metal layer, and a solder layer containing Sn or In as the main component.

Another patent focuses on a Pb-free solder layer that is formed on an electrode layer. This solder layer consists of a base metal, which can be Sn, Sn and Au, or In, along with additional metals such as Bi, Zn, and Sb. The solder layer is designed to have a thickness of 1 to 15 μm and a surface roughness of not more than 0.11 μm, ensuring optimal performance in device bonding applications.

Career Highlights

Hiroki Yokoyama is currently employed at Tokuyama Corporation, where he continues to develop innovative solutions in the field of electronics. His expertise in device bonding technology has positioned him as a key figure in advancing manufacturing processes for electronic devices.

Collaborations

Yokoyama collaborates with talented coworkers, including Yasuko Takeda and Reo Yamamoto. Their combined efforts contribute to the ongoing research and development initiatives at Tokuyama Corporation.

Conclusion

Hiroki Yokoyama's contributions to device bonding technology through his patents and work at Tokuyama Corporation highlight his role as an influential inventor in the electronics industry. His innovative approaches are paving the way for advancements in electronic device manufacturing.