Fukushima, Japan

Hiroki Morikawa

This inventor holds 1 USPTO granted patent. Top assignee: Panasonic Intellectual Property Management Co., Ltd.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroki Morikawa. Retrieved from https://idiyas.com/inventor/hiroki-morikawa-s4gk8fkj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Hiroki Morikawa: Innovator in Printed Wiring Board Technology

Introduction

Hiroki Morikawa is a notable inventor based in Fukushima, Japan. He has made significant contributions to the field of printed wiring board technology. His innovative approach has led to the development of a unique patent that enhances the performance and reliability of printed wiring boards.

Latest Patents

Hiroki Morikawa holds a patent for a printed wiring board and the method for manufacturing it. This invention includes a printed wiring board that features a first insulating layer with a first surface and a second surface opposite from the first surface. A second insulating layer is stacked on the first surface of the first insulating layer, with conductor wiring interposed between the two insulating layers. The first insulating layer is made from a liquid crystal polymer, while the second insulating layer consists of a cured product of a thermosetting composition, which includes an inorganic filler and a thermosetting component, along with a fibrous base member. Notably, the temperature at which the mass of the second insulating layer decreases by 5% reaches 355°C or higher when subjected to a temperature increase rate of 10°C/min from an initial-state temperature of 25°C.

Career Highlights

Hiroki Morikawa is currently employed at Panasonic Intellectual Property Management Co., Ltd. His work at this esteemed company has allowed him to focus on advancing technologies related to printed wiring boards. His dedication to innovation has positioned him as a key figure in his field.

Collaborations

Hiroki has collaborated with talented coworkers, including Hiroaki Takahashi and Masaya Koyama. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Hiroki Morikawa's contributions to printed wiring board technology exemplify his commitment to innovation and excellence. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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