The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 2021

Filed:

Feb. 02, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hiroaki Takahashi, Fukushima, JP;

Masaya Koyama, Mie, JP;

Kiyotaka Komori, Mie, JP;

Yutaka Tashiro, Fukushima, JP;

Hiroki Morikawa, Fukushima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/05 (2013.01); H05K 3/103 (2013.01); H05K 3/4676 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/0195 (2013.01);
Abstract

A printed wiring board includes: a first insulating layer having a first surface and a second surface opposite from the first surface; a second insulating layer stacked on the first surface of the first insulating layer; and a conductor wiring interposed between the first insulating layer and the second insulating layer. The first insulating layer contains a liquid crystal polymer. The second insulating layer contains a cured product of a thermosetting composition, containing an inorganic filler and a thermosetting component, and a fibrous base member. A temperature, at which a decrease in the mass of the second insulating layer that has had its temperature increased at a temperature increase rate of 10° C./min from an initial-state temperature of 25° C. reaches 5% of its initial-state mass, is equal to or higher than 355° C.


Find Patent Forward Citations

Takahashi, Hiroaki. (2021). Printed wiring board and method for manufacturing printed wiring board (U.S. Patent No. 11039533). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11039533

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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