This inventor holds 1 USPTO granted patent. Top assignee: Fujikura Limited. Active years: 2011.
Company Filing History:
Years Active: 2011
Title: Hiroki Hashiba: Innovator in Multilayer Printed Wiring Board Technology
Introduction
Hiroki Hashiba is a notable inventor based in Sakura, Japan. He has made significant contributions to the field of electronics, particularly in the development of multilayer printed wiring boards. His innovative approach has led to advancements that enhance the efficiency and functionality of electronic devices.
Latest Patents
Hiroki Hashiba holds a patent for a "Process for producing multilayer printed wiring board." This invention involves bonding at least one base material, which has a wiring circuit formed into a predetermined outer shape, to a motherboard. The motherboard wiring board and the base material are electrically connected through at least one inner via hole. Notably, the outer shape of the base material is smaller than that of the motherboard, allowing for an island shape on the motherboard.
Career Highlights
Hiroki Hashiba is currently employed at Fujikura Limited, a company known for its innovative solutions in the telecommunications and electronics sectors. His work has been instrumental in advancing the technology behind printed wiring boards, which are essential components in modern electronic devices.
Collaborations
Throughout his career, Hiroki has collaborated with talented individuals such as Shoji Ito and Ryoichi Kishihara. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Hiroki Hashiba's contributions to the field of multilayer printed wiring boards exemplify his commitment to innovation and excellence. His patent and work at Fujikura Limited highlight the importance of advancements in electronic technology.