The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2011

Filed:

May. 11, 2009
Applicants:

Shoji Ito, Sakura, JP;

Ryoichi Kishihara, Sakura, JP;

Osamu Nakao, Sakura, JP;

Hiroki Hashiba, Sakura, JP;

Masahiro Okamoto, Sakura, JP;

Inventors:

Shoji Ito, Sakura, JP;

Ryoichi Kishihara, Sakura, JP;

Osamu Nakao, Sakura, JP;

Hiroki Hashiba, Sakura, JP;

Masahiro Okamoto, Sakura, JP;

Assignee:

Fujikura Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.


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