Kariya, Japan

Hirokazu Saito

This inventor holds 2 USPTO granted patents. Top assignee: Denso Corporation. Active years: 2018-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirokazu Saito. Retrieved from https://idiyas.com/inventor/hirokazu-saito-885bmguy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.2

ph-index = 1


Company Filing History:


Years Active: 2018-2024

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2 patents (USPTO):Explore Patents

Title: Innovations of Hirokazu Saito

Introduction

Hirokazu Saito is a notable inventor based in Kariya, Japan. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards and camera devices. With a total of 2 patents, Saito's work reflects his commitment to enhancing technology in practical applications.

Latest Patents

Saito's latest patents include a printed circuit board and a method of producing a printed circuit board. This innovative design aims to reduce or suppress connection failures. The printed circuit board features a base film made of insulating material, an electric conductor pattern on its front surface, and an insulating cover film that protects the conductor pattern. Additionally, it includes a circuit portion formed by the electric conductor pattern and a pad portion with a bonding pad that is exposed from the insulating cover film. Notably, the pad portion exhibits higher rigidity than the circuit portion.

Another significant patent is for a camera device that incorporates a holder for an optical member and a circuit board with an image sensor. The circuit board consists of a stack of a solder resist, a metallic layer, and a resinous layer. A groove or recess is formed in the circuit board, exposing part of the outer surface of the resinous layer. The holder is attached to this exposed area using an adhesive agent, and an overflow stopper is created around the recess to prevent the adhesive from flowing outside during production. This design enhances the joining of the holder and circuit board, ensuring stability between the image sensor and optical member.

Career Highlights

Hirokazu Saito is currently employed at Denso Corporation, a leading global automotive supplier. His work at Denso has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in automotive technology.

Collaborations

Saito has collaborated with notable coworkers, including Soji Masui and Kazuma Yamaguchi. Their teamwork has fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

Hirokazu Saito's contributions to the fields of printed circuit boards and camera devices highlight his innovative spirit and dedication to technology. His patents reflect a deep understanding of engineering principles and a commitment to improving electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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