The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Jan. 10, 2022
Applicant:
Denso Corporation, Kariya, JP;
Inventors:
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 24/48 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 3/244 (2013.01); H05K 3/4673 (2013.01); H01L 2224/48158 (2013.01); H01L 2224/48464 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/049 (2013.01);
Abstract
A printed circuit board capable of reducing or suppressing connection failure includes a base film made of insulating material, an electric conductor pattern formed on a front surface of the base film, and an insulating cover film covering the electric conductor pattern. The printed circuit board also includes a circuit portion with a circuit formed by the electric conductor pattern, and a pad portion with a bonding pad composed of the electric conductor pattern exposed from the insulating cover film. The pad portion has higher rigidity than the circuit portion.