Tokyo-to, Japan

Hirokazu Oda

This inventor holds 1 USPTO granted patent. Top assignee: Dai Nippon Printing. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirokazu Oda. Retrieved from https://idiyas.com/inventor/hirokazu-oda-0jmtq5lk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hirokazu Oda: Innovator in Curable Resin Composition

Introduction

Hirokazu Oda is a prominent inventor based in Tokyo-to, Japan. He has made significant contributions to the field of materials science, particularly in the development of curable resin compositions for silicon-containing resist.

Latest Patents

Hirokazu Oda holds a patent for a curable resin composition for silicon-containing resist, which includes a polymerizable compound and a polymerization initiator. This innovative composition features a siloxane bond in its molecular structure and contains at least one polymerizable functional group. Notably, the ratio of oxygen atoms bonded to a single silicon atom in the polymerizable compound is 10 mol % or less. Additionally, this curable resin composition does not contain a solvent, and its viscosity is 20 cPs or less. This patent showcases Oda's expertise in creating advanced materials for semiconductor devices.

Career Highlights

Hirokazu Oda is currently employed at Dai Nippon Printing, where he continues to push the boundaries of innovation in his field. His work has been instrumental in enhancing the performance and efficiency of semiconductor manufacturing processes.

Collaborations

Oda collaborates with talented colleagues, including Yasuhiro Okawa and Shintaro Nasu. Together, they contribute to the advancement of technology in their respective areas of expertise.

Conclusion

Hirokazu Oda's contributions to the field of curable resin compositions have positioned him as a key figure in materials science. His innovative patent reflects his commitment to advancing technology in semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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