logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12669749 B1

PDFFull Text
Date of Patent:
Jun. 30, 2026

Filed:

Oct. 06, 2021

Curable resin composition for silicon-containing resist, pattern forming method, method for producing imprint mold, and method for producing semiconductor device

Applicant:

Dai Nippon Printing Co., Ltd., Tokyo-to, JP;

Inventors:

Yasuhiro Okawa, Tokyo-to, JP;

Shintaro Nasu, Tokyo-to, JP;

Masakazu Kaneko, Tokyo-to, JP;

Hirokazu Oda, Tokyo-to, JP;

Assignee:

DAI NIPPON PRINTING CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
G03F 7/075 (2006.01); B29C 33/38 (2006.01); B29C 33/42 (2006.01); C08F 230/08 (2006.01); C08F 292/00 (2006.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/40 (2006.01); H10P 50/00 (2026.01); H10P 76/00 (2026.01); H10P 76/40 (2026.01); B29C 59/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0755 (2013.01); B29C 33/3842 (2013.01); B29C 33/42 (2013.01); C08F 230/08 (2013.01); C08F 292/00 (2013.01); G03F 7/0002 (2013.01); G03F 7/004 (2013.01); G03F 7/075 (2013.01); G03F 7/40 (2013.01); H10P 50/695 (2026.01); H10P 50/73 (2026.01); H10P 76/00 (2026.01); H10P 76/405 (2026.01); B29C 59/02 (2013.01);
Abstract

A curable resin composition for silicon-containing resist including a polymerizable compound, and a polymerization initiator, wherein the polymerizable compound includes a siloxane bond in a molecule, and includes at least one polymerizable functional group; and a ratio of oxygen atoms bonded to a single silicon atom, among oxygen atoms bonded to a silicon atom included in the polymerizable compound, is 10 mol % or less; and the curable resin composition for silicon-containing resist does not contain a solvent, and a viscosity is 20 cPs or less.

Find Patent Forward Citations

Loading…