Hirokazu Katsui

Title: Hirokazu Katsui: Innovator in Conductive Materials

Introduction

Hirokazu Katsui is a prominent inventor based in Sendai, Japan. He has made significant contributions to the field of conductive materials, holding a total of 2 patents. His work focuses on enhancing the properties of copper alloys, which are essential in various industrial applications.

Latest Patents

Katsui's latest patents include a "Conductive Supporting Member and Method for Producing the Same." This invention features a conductive supporting member with an outer portion comprising a Cu matrix phase and a second phase containing a Cu—Zr compound. The inner portion is formed of a metal containing Cu and exhibits higher conductivity than the outer portion. Another notable patent is the "Method for Manufacturing Copper Alloy," which outlines a process for creating a copper alloy by mixing copper powder with a Cu—Zr master alloy or ZrH powder in an inert atmosphere, followed by spark plasma sintering.

Career Highlights

Throughout his career, Hirokazu Katsui has worked with notable organizations such as NGK Insulators, Inc. and Tohoku University. His experience in these institutions has allowed him to develop innovative solutions in the field of conductive materials.

Collaborations

Katsui has collaborated with esteemed colleagues, including Takashi Goto and Naokuni Muramatsu. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Hirokazu Katsui is a distinguished inventor whose work in conductive materials has led to significant advancements in the field. His innovative patents and collaborations highlight his commitment to enhancing the properties of copper alloys.