The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Nov. 21, 2016
Ngk Insulators, Ltd., Nagoya, JP;
Tohoku University, Senda-Shi, JP;
Takashi Goto, Sendai, JP;
Hirokazu Katsui, Sendai, JP;
Naokuni Muramatsu, Nagoya, JP;
Masaaki Akaiwa, Handa, JP;
NGK Insulators, Ltd., Nagoya, JP;
Tohoku University, Sendai, JP;
Abstract
A method for manufacturing a copper alloy according to the present invention comprises (a) weighing a copper powder and one of a Cu—Zr master alloy and a ZrHpowder such that an alloy composition of Cu-xZr (x is the atomic % of Zr, and 0.5≤x≤8.6 is satisfied) is obtained and pulverizing and mixing the copper powder and the one of the Cu—Zr master alloy and the ZrHpowder in an inert atmosphere until an average particle diameter D50 falls within the range of from 1 μm to 500 μm to thereby obtain a powder mixture; and (b) subjecting the powder mixture to spark plasma sintering by holding the powder mixture at a prescribed temperature lower than eutectic temperature while the powder mixture is pressurized at a pressure within a prescribed range.