This inventor holds 39 USPTO granted patents, primarily in Electronic Circuit Packaging. Top assignees: Hitachi, Ltd., Rising Silicon, Inc.. Active years: 1977-2010.
Location History:
- Hitachi, JA (1977)
- Machida, JP (1981 - 2010)
Company Filing History:
Years Active: 1977-2010
Areas of Expertise:
Title: Innovations by Hirokazu Ihara: A Journey Through Patents
Introduction
Hirokazu Ihara, based in Machida, Japan, is a notable name in the field of electronics and circuit design. With an impressive portfolio of 39 patents, Ihara has made significant contributions to the development of electronic circuit packages and related technologies.
Latest Patents
Among his latest innovations is an electronic circuit package that features a wiring substrate equipped with wiring conductors and a multitude of semiconductor bare chips. These chips are essential as they contain a processor responsible for processing data and a specialized circuit designed to detect faults within the processor itself.
Career Highlights
Hirokazu Ihara has amassed a wealth of experience throughout his career, having worked with prestigious companies such as Hitachi, Ltd. and Rising Silicon, Inc. His time in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the field.
Collaborations
During his career, Ihara has collaborated with notable individuals in the industry, including Kinji Mori and Shoji Miyamoto. These professional interactions have significantly contributed to the innovative outputs of his projects and patents.
Conclusion
Hirokazu Ihara’s contributions to the field of electronics, through his numerous patents and collaborative efforts, showcase his dedication and expertise. His work continues to influence advancements in electronic circuit packages, underscoring the importance of innovation in technology.