Location History:
- Shah Alam, MY (2002)
- Souka, JP (2011)
- Saitama, JP (2012)
Company Filing History:
Years Active: 2002-2012
Title: Hirokazu Ichikawa: Innovator in Soldering Technology
Introduction
Hirokazu Ichikawa is a prominent inventor based in Souka, Japan. He has made significant contributions to the field of soldering technology, holding a total of 5 patents. His innovative designs have improved the efficiency and effectiveness of soldering processes in electronic manufacturing.
Latest Patents
Ichikawa's latest patents include an automatic soldering device and a carrier device. The automatic soldering device is designed to enable circuit boards to be fixed in a predetermined position and conveyed to the solder processing portion. It features conveying hooks that hold the printed circuit board, along with conveying chains that drive the hooks from a heater part to a solder bath. The design incorporates first and second frames that guide the conveying chains, as well as an absorbing member that mitigates thermal expansion differences between the frames and chains. This innovation ensures that the printed circuit board remains securely positioned during the soldering process.
Another notable patent is related to a wave soldering bath. In conventional designs, the bottom surface of the bath body can erode due to molten solder, leading to spillage. Ichikawa's invention introduces a shielding member that prevents the vortex of molten solder from affecting the bottom surface, thereby enhancing the durability and reliability of the soldering bath.
Career Highlights
Ichikawa has dedicated his career to advancing soldering technology, particularly in the context of electronic manufacturing. His work at Senju Metal Industry Co., Ltd. has positioned him as a key player in the industry, where he continues to innovate and improve soldering processes.
Collaborations
Throughout his career, Ichikawa has collaborated with notable colleagues, including Mitsuo Zen and Satoshi Ozawa. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in soldering.
Conclusion
Hirokazu Ichikawa's contributions to soldering technology have made a significant impact on the industry. His innovative patents and collaborative efforts continue to shape the future of electronic manufacturing.