Senju Metal Industry Co., Ltd.

Hirokazu Ichikawa

Mitsuo Zen

Satoshi Ozawa

Takashi Sugihara

Toshihiko Mutsuji

Yasuji Kawashima

Shunsuke Kimoto

Tadayoshi Ohtashiro

Kenichi Tomitsuka

Takashi Usuba

Hiroshi Takano

To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooksthat hold the printed circuit board Wtherebetween, conveying chainsthat drive so that the conveying hooksare movable from a heater partto a solder bath, first framesA that guide the conveying chainsalong the heater part, second framesB that guide the conveying chainalong the solder bath, and an absorbing memberthat is provided between each of the first framesA and each of the second framesB and absorbs an expansion and contraction based on difference of any thermal expansion between the framesA,B and the conveying chainsare provided. Since the absorbing memberabsorbs the expansion and contraction based on difference of any thermal expansion between the framesA,B and the conveying chains, it is possible to prevent the conveying chainsfrom being deviated from the framesA,B. This enables the printed circuit board Wto be fixed on the predetermined position and to be conveyed to the heater partand the solder bath

Automatic soldering device and carrier device

In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump (), and the vortex rubs the bottom surface of the bath body. In the present invention, a shielding member () is installed between the duct inlet () and the bottom surface () of the bath body such that the vortex is prevented from affecting the bottom surface.

Wave soldering bath

In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump and the casing was wide, so there was reverse flow through the gap. It is conceivable to narrow the gap, but if the gap is made narrow, the screw pump ends up contacting the casing if the screw pump becomes eccentric. A wave soldering tank according to the present invention makes the diameter of the inlet in the bottom of the casing smaller than the diameter of the screw pump so that reverse flow does not take place even if the gap between the screw pump and the casing is wide. Flow is made more stable by providing outwardly flaring guide walls on the outlet of the casing.

Wave soldering tank

A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. The wave soldering tankhas a tank bodywhich houses molten solder S, a discharge pumpwhich pumps molten solder S, a discharge nozzlewhich spouts molten solder S which was sent to it by the discharge pumpupwards, a ducthaving the discharge pumpinstalled at one of its ends and the discharge nozzleinstalled at its other end, an oxidation preventing memberwhich has a prescribed size and which floats on the surface of the molten solder S, and an engaging meanswhich controls rotation of the oxidation preventing memberin a horizontal plane. The oxidation preventing memberhas a surrounding memberwhich extends downwards at its center and which surrounds the rotating shaftwith a gap between it and the rotating shaft, and a hollow spacein its interior for providing buoyancy.

An apparatus and method for recovering solder from dross present on the surface of a molten solder includes a solder reservoir for holding a pool of molten solder, and a solder nozzle disposed in the solder reservoir and adapted to direct a solder wave against a printed circuit board to be soldered. The solder nozzle includes opposite side troughs inclined downwardly toward one side of the solder reservoir to direct dross toward a dross zone. A semicircular hood extends across the solder reservoir and is located above the dross zone. A screw extends across the solder reservoir and is covered by the hood. The screw is activated to agitate the dross so as to remove oxides and recover solder from the dross.

Growing community of inventors

Souka, Japan

Hirokazu Ichikawa