This inventor holds 1 USPTO granted patent. Top assignee: Sony Corporation. Active years: 2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005
Title: Hiroji Kameda: Innovator in Electronics Packaging
Introduction
Hiroji Kameda is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of electronics packaging, particularly through his innovative patent that enhances the efficiency of electronic device mounting systems.
Latest Patents
Kameda holds a patent for a "System for mounting electronic device." This electronics packaging system includes a printer, a placing unit, and a reflow unit. The system allows a printed wiring board to be carried in an upright position while having solder printed on all lands simultaneously. Electronic parts are placed and soldered to the lands at the same time, resulting in a more compact design and reduced packaging time.
Career Highlights
Hiroji Kameda is currently employed at Sony Corporation, where he continues to develop innovative solutions in electronics. His work has contributed to advancements in the efficiency and compactness of electronic devices.
Collaborations
Kameda has collaborated with notable coworkers, including Katsumi Togasaki and Takanori Arai, who have also contributed to the field of electronics.
Conclusion
Hiroji Kameda's innovative work in electronics packaging exemplifies the impact of effective design and technology in the industry. His contributions continue to influence the way electronic devices are manufactured and assembled.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile