Company Filing History:
3 out of 106 
1 out of 832,718 Years Active: 1993-1995
Title: **Innovative Contributions of Hiroichi Ishikawa in Wafer Processing Technologies**
Introduction
Hiroichi Ishikawa, an accomplished inventor located in Mahwah, NJ, has made significant strides in the field of wafer processing technologies. With a portfolio of four patents, Ishikawa's innovative spirit and technical expertise have fostered advancements in the efficiency and effectiveness of wafer handling techniques.
Latest Patents
Among his notable inventions, Ishikawa's latest patents include a sophisticated wafer processing cluster tool batch preheating and degassing method. This technology introduces a cluster tool equipped with batch preheating modules that receive wafers from a transport module at vacuum pressure. Notably, while one set of wafers undergoes handling and processing, another set can be simultaneously preheated, enhancing overall throughput.
Additionally, his patented method utilizing a pyrometer for measuring and controlling the temperature of stacked articles showcases an innovative approach to accurate temperature management. This technique utilizes a pyrometer positioned outside the chamber to assess the thermal state of overlapping wafers without direct contact, ensuring efficiency regardless of the material properties of the wafers.
Career Highlights
Ishikawa's career has seen him involved with reputable organizations such as Materials Research Corporation. His technical contributions through patents have significantly impacted industries reliant on precise wafer processing methodologies, demonstrating his dedication to innovation and engineering excellence.
Collaborations
Throughout his career, Hiroichi Ishikawa has collaborated with notable professionals, including Michael S. Kolesa and Richard C. Edwards. These partnerships have contributed to the development of groundbreaking technologies that improve wafer processing and meet industry demands efficiently.
Conclusion
Hiroichi Ishikawa’s relentless pursuit of innovation in wafer processing has positioned him as a prominent figure in the field. His patents reflect a pioneering approach to solving complex industry challenges, ultimately leading to advancements that benefit manufacturers and researchers alike. As technological demands evolve, Ishikawa's contributions will undoubtedly continue to play a vital role in shaping the future of wafer processing technologies.
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