Hirohisa Dejima

Title: Hirohisa Dejima: Semiconductor Materials Inventor

Introduction

Hirohisa Dejima is an inventor associated with Utsunomiya, Japan, and Sumitomo Bakelite Company Limited. His work includes a patented resin composition designed for semiconductor applications. The available information credits him with 1 patent.

Latest Patents

Dejima’s patent, “Resin Composition, Filling Material, Insulating Layer and Semiconductor Device,” describes a resin composition for forming material that fills at least a through-hole in a semiconductor substrate. The hole extends through the substrate and contains a conductive portion.

The composition may include a resin with a radical-polymerizable double bond, a thermosetting resin, and another resin with an alkali-soluble group and a double bond. Alternatively, it may include a cyclic olefin resin. The patent also describes cured products made from the composition, including a filling material and an insulating layer. The insulating layer has a surface portion and an integrated filling portion that occupies the substrate’s through-hole. A semiconductor device incorporating this insulating layer is also described.

Career Highlights

Dejima’s listed patent focuses on materials and structures for semiconductor substrates. Its subject matter connects resin formulation with through-hole filling and electrical insulation in semiconductor devices. He is associated with Sumitomo Bakelite Company Limited.

Collaborations

Toyosei Takahashi and Junya Kusunoki are identified as Dejima’s coworkers. The available information does not specify their roles in the patent.

Conclusion

Hirohisa Dejima’s recorded invention addresses resin-based filling and insulation for semiconductor substrates, with potential application in semiconductor device construction.