Kumamoto, Japan

Hirofumi Takakura


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Hirofumi Takakura: Innovator in Thin-Film Technology

Introduction

Hirofumi Takakura is a notable inventor based in Kumamoto, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of thin-film structures. His innovative work has led to advancements in acceleration sensors, showcasing his expertise and dedication to the field.

Latest Patents

Hirofumi Takakura holds a patent for a "Thin-film structure and method for manufacturing the same, and acceleration sensor and method for manufacturing the same." This patent describes a thin-film structural body created using semiconductor processing techniques. The invention allows for easy stress control of the thin-film member and facilitates the production of thicker films. The thin-film member serves as a mass body, with beams and fixed electrodes of the semiconductor acceleration sensor formed by multiple doped polysilicon thin-films. These films are laminated through a process of polysilicon film deposition while doping with phosphorous as impurities.

Career Highlights

Hirofumi Takakura is associated with Mitsubishi Denki Kabushiki Kaisha, a leading company in the electronics and technology sector. His work at Mitsubishi has allowed him to focus on innovative solutions in semiconductor technology, contributing to the company's reputation for excellence in research and development.

Collaborations

Hirofumi has collaborated with esteemed colleagues such as Kiyoshi Ishibashi and Makio Horikawa. Their combined expertise has fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Hirofumi Takakura's contributions to thin-film technology and semiconductor acceleration sensors highlight his role as a key innovator in the field. His patent and collaborative efforts reflect a commitment to advancing technology and improving manufacturing processes.

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