Hirofumi Ogawa

Title: Hirofumi Ogawa: Innovator in Circuit Board Technology

Introduction

Hirofumi Ogawa is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of circuit board technology, holding two patents that showcase his innovative approach to electronic design.

Latest Patents

Ogawa's latest patents include advancements in circuit board devices and printed wiring boards. One of his patents describes a circuit board device that features a printed wiring board, an IC chip on the obverse surface, and a wiring pattern that provides ground potential to the IC chip's ground terminal. This wiring pattern is strategically placed on the reverse surface of the printed wiring board. Additionally, the device incorporates at least one via that connects to the wiring pattern, passing through the board at a location where the IC chip is mounted.

Career Highlights

Hirofumi Ogawa is currently employed at Lapis Semiconductor Co., Ltd., where he continues to develop innovative solutions in the semiconductor industry. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Ogawa collaborates with talented colleagues, including Kentaro Toda and Kenji Arai, who contribute to the innovative environment at Lapis Semiconductor Co., Ltd. Their teamwork fosters creativity and drives advancements in technology.

Conclusion

Hirofumi Ogawa's contributions to circuit board technology reflect his dedication to innovation and excellence. His patents not only advance the field but also demonstrate the importance of collaboration in achieving technological breakthroughs.