The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Feb. 20, 2018
Lapis Semiconductor Co., Ltd., Yokohama, JP;
Kentaro Toda, Yokohama, JP;
Kenji Arai, Yokohama, JP;
Manabu Miyazawa, Yokohama, JP;
Kenichiro Nagatomo, Yokohama, JP;
Touru Ueno, Yokohama, JP;
Tsuguto Maruko, Yokohama, JP;
Hirofumi Ogawa, Yokohama, JP;
Tetsuo Oomori, Yokohama, JP;
LAPIS Semiconductor Co., Ltd., Yokohama, JP;
Abstract
A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.