Nagano, Japan

Hirofumi Maruyama

This inventor holds 4 USPTO granted patents. Top assignees: Tamagawa Seiki Co., Ltd., Lapis Semiconductor Co., Ltd.. Active years: 2018-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirofumi Maruyama. Retrieved from https://idiyas.com/inventor/hirofumi-maruyama-zpm2bur0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Nagano-ken, JP (2018 - 2022)
  • Nagano Prefecture, JP (2022)

Company Filing History:


Years Active: 2018-2025

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4 patents (USPTO):Explore Patents

Title: Hirofumi Maruyama: Innovations in R/D Conversion and Magnet Wire Bonding

Introduction

Hirofumi Maruyama, an inventive force hailing from Nagano-ken, Japan, has made significant contributions to the fields of electronic engineering and signal processing. With a portfolio boasting four patents, Maruyama's work demonstrates innovative approaches to R/D conversion methods and magnet wire bonding techniques, showcasing his commitment to advancing technology.

Latest Patents

Maruyama's latest patents include a groundbreaking R/D conversion method and an innovative magnet wire bonding method. The R/D conversion method specifically involves removing a frequency band that incorporates a frequency component twice that of the excitation frequency of excitation signals from a digital angle value. This method ensures that the resolver outputs signals corresponding to the resolver's angle with respect to these excitation signals. Additionally, the feedback mechanism enhances the accuracy of the digital angle value, improving the overall efficiency of the conversion process.

The magnet wire bonding method represents a significant advancement in the bonding process. It introduces an ultrasonic bonding technique for magnet wires with a longitudinally spread state, ensuring that the wires do not entangle during the bonding process. By utilizing a terminal pin designed with a flat plate part to hold the magnet wire securely, this method enhances the reliability and effectiveness of electronic connections.

Career Highlights

Hirofumi Maruyama has worked with notable companies, including Tamagawa Seiki Co., Ltd. and Lapis Semiconductor Co., Ltd. His experience in these respected organizations has undoubtedly played a crucial role in developing his innovative inventions. Maruyama's expertise in signal processing and electronic engineering is reflected in the patents he holds, marking him as a key contributor to technological advancements.

Collaborations

Throughout his career, Maruyama has collaborated with esteemed colleagues such as Hiroshi Kushihara and Shinichi Arai. These partnerships have likely facilitated knowledge exchange and innovation, further enhancing the quality and impact of his inventions.

Conclusion

Hirofumi Maruyama stands out as a prominent inventor whose work in R/D conversion methods and magnet wire bonding techniques has made a meaningful impact on the electronics industry. With a strong foundation in engineering and a dedication to innovation, Maruyama continues to pave the way for future advancements in technology. As his career progresses, it will be exciting to see how his contributions will inspire further innovations in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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