The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Jun. 26, 2019
Tamagawa Seiki Co., Ltd., Nagano-ken, JP;
Hiroshi Kushihara, Nagano-ken, JP;
Kazuyuki Ishibashi, Nagano-ken, JP;
Hirofumi Maruyama, Nagano-ken, JP;
Shinichi Arai, Nagano-ken, JP;
Toshiki Muramatsu, Nagano-ken, JP;
Shinichi Hara, Nagano-ken, JP;
Katsutoshi Toyotake, Nagano-ken, JP;
TAMAGAWA SEIKI CO., LTD., Nagano-Ken, JP;
Abstract
The present invention relates to a magnet wire bonding method and a bonding structure, and more particularly to a new improvement for ultrasonically bonding a longitudinal outer peripheral surface of a magnet wire having no entangling part to a flat surface of a flat part of a terminal pin. A magnet wire bonding method and structure, comprising: using a terminal pin () having a flat plate part () provided in a pin part () as a terminal pin holding part (); placing a magnet wire () in a longitudinally spread state on a flat surface () of the flat plate part () without being entangled; and ultrasonically bonding an outer peripheral surface (E) of the magnet wire () onto the flat surface () with an ultrasonic horn ().