Company Filing History:
Years Active: 2022
Title: Shinichi Hara - Innovator in Magnet Wire Bonding Technology
Introduction
Shinichi Hara is a notable inventor based in Nagano-ken, Japan. He has made significant contributions to the field of bonding technologies, particularly with his innovative methods for magnet wire bonding. His work has implications for various applications in electronics and electrical engineering.
Latest Patents
Shinichi Hara holds a patent for a magnet wire bonding method and bonding structure. This invention focuses on improving the ultrasonic bonding of a magnet wire to a terminal pin. The method involves using a terminal pin with a flat plate part, allowing the magnet wire to be placed in a longitudinally spread state on a flat surface without entanglement. The ultrasonic bonding process ensures a secure connection between the outer peripheral surface of the magnet wire and the flat surface of the terminal pin.
Career Highlights
Hara is associated with Tamagawa Seiki Co., Ltd., where he has been able to apply his expertise in bonding technologies. His innovative approach has led to advancements in the efficiency and reliability of electrical connections in various devices.
Collaborations
Shinichi Hara has worked alongside talented colleagues such as Hiroshi Kushihara and Kazuyuki Ishibashi. Their collaborative efforts have contributed to the development of cutting-edge technologies in the field.
Conclusion
Shinichi Hara's contributions to magnet wire bonding technology exemplify the importance of innovation in the electronics industry. His patent reflects a significant advancement that enhances the reliability of electrical connections.