Anjo, Japan

Hirofumi Koike

This inventor holds 1 USPTO granted patent. Top assignee: Aisin Seiki Kabushiki Kaisha. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirofumi Koike. Retrieved from https://idiyas.com/inventor/hirofumi-koike-zh6d72k5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Hirofumi Koike: Innovator in Solder Joint Evaluation

Introduction

Hirofumi Koike is a notable inventor based in Anjo, Japan. He has made significant contributions to the field of solder joint evaluation, showcasing his expertise through innovative methods and patents.

Latest Patents

Hirofumi Koike holds a patent for a "Method for evaluating solder joint portion." This method involves a preparation process for the substrate that includes the solder joint portion, a thermal shock process that applies thermal shock multiple times, and an evaluation process that assesses changes in crystal grain size in the solder joint portion. The evaluation is crucial for determining the lifespan of the solder joint based on these changes. He has 1 patent to his name.

Career Highlights

Hirofumi Koike is associated with Aisin Seiki Kabushiki Kaisha, a company known for its advancements in automotive technology and manufacturing. His work at Aisin Seiki has allowed him to focus on improving the reliability and performance of solder joints in various applications.

Collaborations

Hirofumi Koike has collaborated with notable colleagues such as Yoshiharu Hirose and Juntaro Seki. Their combined efforts contribute to the innovative environment at Aisin Seiki, fostering advancements in technology.

Conclusion

Hirofumi Koike's contributions to solder joint evaluation highlight his innovative spirit and dedication to improving technology in the automotive industry. His work continues to influence the field and enhance the reliability of solder joints in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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