The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Mar. 27, 2008
Hirofumi Koike, Anjo, JP;
Akikazu Matsumoto, Anjo, JP;
Wataru Yagi, Nagoya, JP;
Takefumi Isogai, Chiryu, JP;
Yoshiharu Hirose, Aichi-gun, JP;
Hiroaki Kadoura, Seto, JP;
Juntaro Seki, Aichi-gun, JP;
Hisaaki Takao, Seto, JP;
Hirofumi Koike, Anjo, JP;
Akikazu Matsumoto, Anjo, JP;
Wataru Yagi, Nagoya, JP;
Takefumi Isogai, Chiryu, JP;
Yoshiharu Hirose, Aichi-gun, JP;
Hiroaki Kadoura, Seto, JP;
Juntaro Seki, Aichi-gun, JP;
Hisaaki Takao, Seto, JP;
Aisin Seiki Kabushiki Kaisha, Kariya-shi, JP;
Abstract
A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.