Hirobumi Matsui

Title: Innovations of Hirobumi Matsui

Introduction

Hirobumi Matsui is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the durability and efficiency of semiconductor devices.

Latest Patents

Matsui's latest patents include a semiconductor device and manufacturing method designed to prevent aluminum corrosion and improve the durability of gold bonding wires. This innovative semiconductor device features a conductive film of aluminum, which serves as a pad electrode, along with a metal film and a protective film. The design includes a metal film region where atoms from the metal film are implanted, enhancing the device's performance.

Another notable patent is a sensor device module that integrates a sensor element with a protective film, an integrated circuit, and a bonding pad. This module connects the sensor element and the integrated circuit through a contact part, utilizing a metal thin film layer composed of multiple metal layers. The design also incorporates an insulating film and an exfoliation sacrifice layer, ensuring optimal functionality and protection.

Career Highlights

Hirobumi Matsui is currently employed at Mitsubishi Electric Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing technology that impacts various applications in electronics.

Collaborations

Matsui collaborates with talented colleagues such as Shinichi Hosomi and Yuji Kawano, contributing to a dynamic and innovative work environment.

Conclusion

Hirobumi Matsui's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in electronic devices and systems.