Chuo-ku, Japan

Hiroaki Funada


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Hiroaki Funada: Innovator in Pattern Film Technology

Introduction

Hiroaki Funada is a notable inventor based in Chuo-ku, Japan. He has made significant contributions to the field of pattern film technology, particularly through his innovative methods that enhance the precision of film formation.

Latest Patents

Hiroaki Funada holds a patent for a "Method for forming a pattern film with a narrower width." This method provides a solution for creating a pattern film that is narrower than the resolution of an exposure machine. The process involves several steps, including the formation of a first frame layer and a second frame layer, as well as a trench-forming film that allows for the creation of a pattern film that fills the trench.

Career Highlights

Hiroaki Funada is associated with TDK Corporation, a leading company in electronic components and solutions. His work at TDK has allowed him to focus on advancing technologies that are crucial for various applications in the electronics industry.

Collaborations

Hiroaki has collaborated with notable colleagues such as Hirotaka Gomi and Mitsuharu Isobe. These collaborations have contributed to the development of innovative solutions in their respective fields.

Conclusion

Hiroaki Funada's contributions to pattern film technology exemplify the impact of innovation in the electronics sector. His patent and collaborative efforts highlight the importance of precision in modern manufacturing processes.

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