Tdk Corporation

Hiroaki Funada

Noriyuki Ito

Yasuhiro Hasegawa

Hirotaka Gomi

Mitsuharu Isobe

Takeshi Yamana

Makoto Terasawa

A method for forming a pattern film with a narrower width than the resolution of an exposure machine and a resist used independently of etching is provided. The method comprises the steps of: forming a first frame layer having end surfaces facing each other across a space having a width W; forming a second frame layer having end surfaces facing each other across a space having a width Wthat is larger than the width W, the space having the width Wbeing located right above the space having the width W; forming a trench-forming film provided with a trench having a minimum width Wthat is smaller than the width Wso as to fill at least a part of the spaces having the width Wand the width Wrespectively; and forming a pattern film so as to fill at least a part of the trench.

Growing community of inventors

Chuo-ku, Japan

Hiroaki Funada