The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2011

Filed:

Mar. 22, 2007
Applicants:

Hirotaka Gomi, Chuo-ku, JP;

Mitsuharu Isobe, Chuo-ku, JP;

Noriyuki Ito, Chuo-ku, JP;

Hiroaki Funada, Chuo-ku, JP;

Takeshi Yamana, Chuo-ku, JP;

Makoto Terasawa, Chuo-ku, JP;

Yasuhiro Hasegawa, Chuo-ku, JP;

Inventors:

Hirotaka Gomi, Chuo-ku, JP;

Mitsuharu Isobe, Chuo-ku, JP;

Noriyuki Ito, Chuo-ku, JP;

Hiroaki Funada, Chuo-ku, JP;

Takeshi Yamana, Chuo-ku, JP;

Makoto Terasawa, Chuo-ku, JP;

Yasuhiro Hasegawa, Chuo-ku, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for forming a pattern film with a narrower width than the resolution of an exposure machine and a resist used independently of etching is provided. The method comprises the steps of: forming a first frame layer having end surfaces facing each other across a space having a width W; forming a second frame layer having end surfaces facing each other across a space having a width Wthat is larger than the width W, the space having the width Wbeing located right above the space having the width W; forming a trench-forming film provided with a trench having a minimum width Wthat is smaller than the width Wso as to fill at least a part of the spaces having the width Wand the width Wrespectively; and forming a pattern film so as to fill at least a part of the trench.


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