New York, NY, United States of America

Hiro O Atsumi

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Bank of America Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiro O Atsumi. Retrieved from https://idiyas.com/inventor/hiro-o-atsumi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hiro O. Atsumi and Digital Supply Chain Innovation.

Introduction

Hiro O. Atsumi is an inventor associated with New York, New York, and Bank of America Corporation. His patent work focuses on applying digital technologies to supply chain documentation and automation.

Latest Patents

Atsumi is credited with 1 patent, titled “Digital Platform Supply Chain Solutions System.” The invention describes an integrated supply chain automation platform that transforms official, standard physical documents into official, standard digital documents. It includes an artificial intelligence and machine learning processor designed to parse uploaded documents, return matched documents, and identify discrepancies. The system also describes a network of applications in a hybrid cloud environment, connected to the platform and processor through a middleware engine.

Career Highlights

Atsumi’s patent reflects an approach to supply chain operations that combines document digitization, AI/ML processing, and connections among cloud-based applications. The disclosed system is intended to support automation while helping users identify inconsistencies in supply chain records.

Collaborations

Atsumi’s listed coworkers include Gregory Barrett and Rachel A. Lauck. His association with Bank of America Corporation provides the organizational context for his work on digital supply chain solutions.

Conclusion

Hiro O. Atsumi’s patent describes a technology platform for digitizing supply chain documents and coordinating their processing across connected applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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