The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Nov. 26, 2024
Bank of America Corporation, Charlotte, NC (US);
Gregory Barrett, Charlotte, NC (US);
Rachel A. Lauck, Scranton, PA (US);
Duncan Edward Lodge, London, GB;
Robin E. Tooker, Charlotte, NC (US);
Lesley Roxe Mcnamara, New York, NY (US);
Mark D. Zanzot, Charlotte, NC (US);
Teela Phuong Yung, Hacienda Heights, CA (US);
Madhav Goparaju, Chicago, IL (US);
Hiro O. Atsumi, New York, NY (US);
Ilian Radev, Chicago, IL (US);
Kelly M. Murray, Plano, TX (US);
David J. Mcginness, Matthews, NC (US);
Geoffrey Brady, New York, NY (US);
Matthew Vincent, Charlotte, NC (US);
Bank of America Corporation, Charlotte, NC (US);
Abstract
Systems and methods for providing digital platform supply chain solutions for an integrated supply chain automation platform by transforming official, standard physical documentation into official, standard digital documentation. The systems and methods may include an integrated supply chain automation platform. The systems and methods may include an artificial intelligence/machine learning ('AI/ML') processor. The AI/ML processor may be operable to parse uploaded documents, output matched documents, and identify discrepancies within the platform. The systems and methods may include a network of applications. The network of applications may be contained in a hybrid cloud environment. The systems and methods may include a middleware engine. The middleware engine may be operable to connect, within the hybrid cloud environment: the platform, the AI/ML processor, and the network of applications.