This inventor holds 1 USPTO granted patent. Top assignee: C.uyemura Co., Ltd.. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Innovations of Hideyuki Tsubokura
Introduction
Hideyuki Tsubokura is a notable inventor based in Hirakata, Japan. He has made significant contributions to the field of electroplating, particularly with his innovative approach to tin-copper alloy plating.
Latest Patents
Tsubokura holds a patent for a tin-copper alloy electroplating bath. This invention comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention enables the formation of a tin-copper alloy deposit, serving as a replacement for tin-lead alloy plating on various electronic components such as chips, quartz crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages, and printed circuit boards. He has 1 patent to his name.
Career Highlights
Tsubokura is associated with C. Uyemura Co., Ltd., where he has been able to apply his expertise in electroplating technologies. His work has contributed to advancements in the manufacturing processes of electronic parts.
Collaborations
He has collaborated with notable coworkers, including Isamu Yanada and Masanobu Tsujimoto, to further enhance the development of innovative electroplating solutions.
Conclusion
Hideyuki Tsubokura's contributions to the field of electroplating, particularly through his patent for a tin-copper alloy electroplating bath, highlight his role as an influential inventor in Japan. His work continues to impact the electronics industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile