Numazu, Japan

Hideyoshi Horimai

This inventor holds 1 USPTO granted patent. Top assignee: 3Dragons, LLC. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideyoshi Horimai. Retrieved from https://idiyas.com/inventor/hideyoshi-horimai-kj8qw8e2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations by Hideyoshi Horimai

Introduction

Hideyoshi Horimai is a notable inventor based in Nuamzu, Japan. He has made significant contributions to the field of three-dimensional shape measurement technology. His innovative approach focuses on enhancing precision while reducing costs in measurement devices.

Latest Patents

Horimai holds a patent for a three-dimensional shape measuring device, which includes a method for acquiring hologram images and a method for measuring three-dimensional shapes. The primary problem addressed by this invention is the need for a low-cost, high-precision three-dimensional shape measuring device utilizing vibration-resistant phase shift digital holography. The solution involves a sophisticated optical system that detects relative phase differences in circularly polarized light, allowing for the acquisition of multiple hologram images with varying phase differences.

Career Highlights

Horimai is associated with 3Dragons, LLC, where he continues to develop and refine his innovative technologies. His work has garnered attention for its practical applications in various industries, particularly in fields requiring precise measurements.

Collaborations

One of his notable collaborators is Taizo Umezaki, with whom he has worked on advancing measurement technologies.

Conclusion

Hideyoshi Horimai's contributions to three-dimensional shape measurement technology exemplify the intersection of innovation and practicality. His patent reflects a commitment to improving measurement accuracy while maintaining cost-effectiveness.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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