Miyazaki, Japan

Hideyo Kuroki


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: The Innovations of Hideyo Kuroki

Introduction

Hideyo Kuroki is a notable inventor based in Miyazaki, Japan. He has made significant contributions to the field of semiconductor manufacturing. His innovative methods have paved the way for advancements in technology.

Latest Patents

Kuroki holds a patent for a "Method of manufacturing a semiconductor wafer." This patent describes a process where a sliced wafer is obtained from a semiconductor ingot. The rear and front surfaces of the sliced wafer are flattened through a double side simultaneous grinding process to remove any unevenness. Following this, the surfaces undergo a second grinding process. The back side of the wafer is then chamfered, and the surface is etched to enhance its quality.

Career Highlights

Kuroki is associated with Komatsu Electronic Metals Co., Ltd., where he has applied his expertise in semiconductor technology. His work has been instrumental in improving manufacturing processes within the industry.

Collaborations

Kuroki has collaborated with Masahiko Maeda, contributing to the development of innovative solutions in semiconductor manufacturing.

Conclusion

Hideyo Kuroki's contributions to semiconductor technology through his patent and work at Komatsu Electronic Metals Co., Ltd. highlight his role as a significant inventor in the field. His innovative methods continue to influence the industry today.

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