The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2000
Filed:
Nov. 19, 1998
Applicant:
Inventors:
Hideyo Kuroki, Miyazaki, JP;
Masahiko Maeda, Miyazaki, JP;
Assignee:
Komatsu Electronic Metals Co., Ltd., Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438692 ; 438690 ; 438691 ; 438706 ;
Abstract
A sliced wafer 1a is obtained by cutting it off from a semiconductor ingot. The rear and front surfaces of the sliced wafer 1a are flattened by the first double side simultaneous grinding process so as to remove unevenness 12a. The ground rear and front surfaces of the sliced wafer 1a whose unevenness 12a has been removed are subject to the second double side simultaneous grinding process. The flattened back side surface of the sliced wafer 1b is sucked so as to chamfer the outer peripheral portion 1b of the sliced wafer 1b. Then, the surface of the chamfered wafer 1c is etched.