Hideyasu Tagusari

Title: Innovations of Hideyasu Tagusari

Introduction

Hideyasu Tagusari is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of electrodeposited copper foils for printed wiring boards. With a total of 2 patents, his work has been instrumental in advancing technology in electronic manufacturing.

Latest Patents

Tagusari's latest patents focus on the creation of an electrodeposited copper foil designed for use in printed wiring boards. This innovative foil features a matte surface that has been completely refined, preferably through buffing, resulting in a surface with linear streaks and a roughness of 1.5 µm or less. Following this, a nodule forming treatment is applied to achieve a surface roughness of 1.5 to 2.0 µm, which may be enhanced with a corrosion resisting treatment. This invention is particularly valuable for producing fine circuit patterns, showcasing Tagusari's expertise in material engineering.

Career Highlights

Throughout his career, Hideyasu Tagusari has worked with prominent companies such as Mitsui Mining & Smelting Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in his field.

Collaborations

Tagusari has collaborated with notable colleagues, including Yutaka Hirasawa and Kazuhide Oshima. These partnerships have fostered innovation and have been crucial in the development of his patented technologies.

Conclusion

Hideyasu Tagusari's contributions to the field of materials science, particularly through his patents on electrodeposited copper foils, highlight his role as a key innovator in electronic manufacturing. His work continues to influence the industry and pave the way for future advancements.