Mitsui Minings & Melting Co., Ltd.

Mitsui Mining & Smleting Co., Ltd.

Hideyasu Tagusari

Yutaka Hirasawa

Kazuhide Oshima

An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.

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Tokyo, Japan

Hideyasu Tagusari