This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Ngk Spark Plug Company, Limited. Active years: 2014-2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014-2015
Title: Hidetoshi Wada: Innovator in Multilayer Wiring Board Technology
Introduction
Hidetoshi Wada is a prominent inventor based in Komaki, Japan. He has made significant contributions to the field of electrical engineering, particularly in the development of multilayer wiring boards. With a total of 2 patents to his name, Wada's innovations are paving the way for advancements in electronic components.
Latest Patents
Wada's latest patents focus on multilayer wiring boards that enhance the reliability and performance of electronic devices. One of his notable inventions includes a multilayer wiring board that features a build-up layer composed of multiple conductor and resin insulation layers. This design incorporates conductive pads that project from the surface of the resin insulation layer, minimizing stress concentration and preventing defective connections to semiconductor elements. Another patent describes a similar multilayer wiring board, where the upper surface of the conductive pads has a recess, allowing the solder layer to be elevated compared to the outer periphery. These innovations are crucial for improving the durability and functionality of electronic components.
Career Highlights
Hidetoshi Wada is currently employed at NGK Spark Plug Company, Limited, where he continues to innovate in the field of electrical engineering. His work has garnered attention for its practical applications in enhancing the performance of electronic devices. Wada's expertise and dedication to his craft have established him as a respected figure in the industry.
Collaborations
Wada has collaborated with talented coworkers, including Takuya Hando and Masahiro Inoue. Their combined efforts contribute to the innovative environment at NGK Spark Plug Company, Limited, fostering advancements in technology.
Conclusion
Hidetoshi Wada's contributions to multilayer wiring board technology exemplify his commitment to innovation in electrical engineering. His patents reflect a deep understanding of the challenges in the field and offer solutions that enhance the reliability of electronic devices. Wada's work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
